* Composition: Sn-63%, Pb-37%

* Solder particle size: 24 – 45 µm

* Flux type: No Clean

* Melting point: 200°C

* Residues do not require cleaning

* Easily washed off with alcohol-based products

* Packing: Composition: Sn-63%, Pb -37%

* Solder particle size: 24 – 45µm

* Packing: 35grmm (10ml)

Solder Balls BGA Reballing   Soldering Accessories for Chip Planting Laptop Phone Repair

• Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
• Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
• Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 100 thousand grains, a large number, can meet your use and replacement needs, very practically.
• Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.

Solder Balls BGA Reballing   Soldering Accessories for Chip Planting Laptop Phone Repair

• Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
• Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
• Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 100 thousand grains, a large number, can meet your use and replacement needs, very practically.
• Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.

63-37 Solder Wire Tin Lead Rosin Core Solder Wire for Electrical Soldering

Solder wire of 100 grams with a diameter of 0.75 mm is one of the solder wires of Turkish brand SOLDEX.

This wire is made of 63% tin and 37% lead and has a low melting temperature.

With a thickness and diameter of 0.75 mm, this wire comes in a weight of 100 grams.

This product is the most practical soldering tool, especially in the assembly and disassembly of electronic components.