* Composition: Sn-63%, Pb-37%

* Solder particle size: 24 – 45 µm

* Flux type: No Clean

* Melting point: 200°C

* Residues do not require cleaning

* Easily washed off with alcohol-based products

* Packing: Composition: Sn-63%, Pb -37%

* Solder particle size: 24 – 45µm

* Packing: 35grmm (10ml)

Solder Balls BGA Reballing   Soldering Accessories for Chip Planting Laptop Phone Repair

• Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
• Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
• Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 100 thousand grains, a large number, can meet your use and replacement needs, very practically.
• Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.