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Mechanic XG-Z40 10cc
1 × 600 L
Nënshumë: 600 L
-17%
Electronic Components, Hardware, Solder, Work Tools
Kurtel 0.75 mm 200gr
Material: 60% Tin / % 40 Lead
Wire Diameter: 0.75mm
Flux: 3%
Product weight: 200g
1,800 L 2,160 L
Kurtel
Kurtel 200 Gram 0.75mm Soldering Wire
Material: 60% Tin / % 40 Lead
kurtel-075-mm-200gr-solder-wire-60-tin-40-lead-kurtel-solder-wires-kurtel-49593-31-BWire Diameter: 0.75mm
Flux: 3%
Product weight: 200g
Soldering Wire
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Electronic Components, Hardware, Solder, Work Tools
Mechanic XG-Z40 10cc
* Composition: Sn-63%, Pb-37%
* Solder particle size: 24 – 45 µm
* Flux type: No Clean
* Melting point: 200°C
* Residues do not require cleaning
* Easily washed off with alcohol-based products
* Packing: Composition: Sn-63%, Pb -37%
* Solder particle size: 24 – 45µm
* Packing: 35grmm (10ml)
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Desoldering Pump, Electronic Components, Hardware, Tools, Work Tools
Copper Desoldering Wire 9DP-031A: 9DP-031B: 9DP-031C
Desoldering Pump, Electronic Components, Hardware, Tools, Work ToolsCopper Desoldering Wire 9DP-031A: 9DP-031B: 9DP-031C
this ProsKit 9DP-031 desoldering wire is a professional-grade copper wick that is woven with the anti-oxidation capability to achieve high performance in desoldering operation. This 9DP-031 desoldering wire features high performance, lightweight, portability, pure oxygen-free copper property, and flux cleanliness. The ProsKit desoldering wire is presented in three optional models of 9DP-031A, 9DP-031B, and 9DP-031C, with three optional widths of 1.5mm, 2mm, and 2.5mm.
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Electronic Components, Hardware, Solder, Work Tools
Solder Balls BGA Reballing ppd alloy sn63pb37 0.3mm
Electronic Components, Hardware, Solder, Work ToolsSolder Balls BGA Reballing ppd alloy sn63pb37 0.3mm
ppd alloy sn63pb37 solder ball
Solder Balls BGA Reballing Soldering Accessories for Chip Planting Laptop Phone Repair
- Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
- Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
- Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 100 thousand grains, a large number, can meet your use and replacement needs, very practically.
- Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.
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