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Kurtel 0.75 mm 200gr
1 × 1,800 L
Nënshumë: 1,800 L
-17%
Hardware, Solder, Work Tools
Kurtel 1.2 mm 200gr
Kurtel
Kurtel 200 Gram 1.2mm Soldering Wire
Material: 60% Tin / % 40 Lead
kurtel-1.2-mm-200gr-solder-wire-60-tin-40-lead-kurtel-solder-wires-kurtel-49593-31-BWire Diameter: 1.2mm
Flux: 3%
Product weight: 200g
1,800 L 2,160 L
Kurtel
Kurtel 200 Gram 1.2mm Soldering Wire
Material: 60% Tin / % 40 Lead
kurtel-1.2-mm-200gr-solder-wire-60-tin-40-lead-kurtel-solder-wires-kurtel-49593-31-BWire Diameter: 1.2mm
Flux: 3%
Product weight: 200g
Soldering Wire
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Desoldering Pump, Electronic Components, Hardware, Tools, Work Tools
Copper Desoldering Wire 9DP-031A: 9DP-031B: 9DP-031C
Desoldering Pump, Electronic Components, Hardware, Tools, Work ToolsCopper Desoldering Wire 9DP-031A: 9DP-031B: 9DP-031C
this ProsKit 9DP-031 desoldering wire is a professional-grade copper wick that is woven with the anti-oxidation capability to achieve high performance in desoldering operation. This 9DP-031 desoldering wire features high performance, lightweight, portability, pure oxygen-free copper property, and flux cleanliness. The ProsKit desoldering wire is presented in three optional models of 9DP-031A, 9DP-031B, and 9DP-031C, with three optional widths of 1.5mm, 2mm, and 2.5mm.
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2 Bay M.2 SATA Clone Docking Stations, SSD Duplicator Support One-Key System Disk Copy Function Hard Drive Accessories
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2 Bay M.2 SATA Clone Docking Stations, SSD Duplicator Support One-Key System Disk Copy Function Hard Drive Accessories
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Electronic Components, Hardware, Solder, Work Tools
SOLDEX 0.75M 200g SOLDER WIRE
63-37 Solder Wire Tin Lead Rosin Core Solder Wire for Electrical Soldering
Solder wire of 100 grams with a diameter of 0.75 mm is one of the solder wires of Turkish brand SOLDEX.
This wire is made of 63% tin and 37% lead and has a low melting temperature.
With a thickness and diameter of 0.75 mm, this wire comes in a weight of 100 grams.
This product is the most practical soldering tool, especially in the assembly and disassembly of electronic components.
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