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solder ball ppd alloy sn63pb37 0.4mm
1 × 200 L -
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Solder Balls BGA Reballing ppd alloy sn63pb37 0.3mm
1 × 200 L
Nënshumë: 400 L
-17%
Electronic Components, Hardware, Solder, Work Tools
SOLDEX 0.75M 200g SOLDER WIRE
63-37 Solder Wire Tin Lead Rosin Core Solder Wire for Electrical Soldering
Solder wire of 100 grams with a diameter of 0.75 mm is one of the solder wires of Turkish brand SOLDEX.
This wire is made of 63% tin and 37% lead and has a low melting temperature.
With a thickness and diameter of 0.75 mm, this wire comes in a weight of 100 grams.
This product is the most practical soldering tool, especially in the assembly and disassembly of electronic components.
1,800 L 2,160 L
Soldex
63-37 Solder Wire
63-37 Solder Wire Tin Lead Rosin Core Solder Wire for Electrical Soldering
Solder wire of 100 grams with a diameter of 0.75 mm is one of the solder wires of Turkish brand SOLDEX.
This wire is made of 63% tin and 37% lead and has a low melting temperature.
With a thickness and diameter of 0.75 mm, this wire comes in a weight of 100 grams.
This product is the most practical soldering tool, especially in the assembly and disassembly of electronic components.
SOLDER WIRE
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Electronic Components, Hardware, Solder, Work Tools
solder ball ppd alloy sn63pb37 0.4mm
Solder Balls BGA Reballing Soldering Accessories for Chip Planting Laptop Phone Repair
- Extensive Usage: Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultrasmall ball tin electronic parts, etc.
- Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic .
- Practical Tool: Small size, easy to carry and store, convenient to use and with good performance, 100 thousand grains, a large number, can meet your use and replacement needs, very practically.
- Premium Quality: The solder with tin balls is more and can help you solder effectively. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit.
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